3D TLC / M Key

MEC3H0S

  • NGFF M.2 standard form factor
  • Supports data security with AES-256 Encryption (optional)
  • Supports SP Toolbox S.M.A.R.T. health monitoring software

 

SPEZIFIKATIONEN

Overview
Interface
PCIe Gen4x4, NVMe 1.4
Flash Technology
3D TLC
Capacity
3840GB
Form Factor
M.2 2280 (M key)
Dimensions
80.0 x 22.0 x 3.5 mm
DRAM
External DRAM
Performance
Seq. Performance Read (max.)
7,100 MB/s
Seq. Performance Write (max.)
6,600 MB/s
Random 4K Read (IOPS max.)
1,040,000
Random 4K Write (IOPS max.)
860,000
MTBF @ 25°C
>3,000,000 hrs
P/E Cycle
3,000
TBW
3840GB: 9,720 TB
Operating Environment
Operating Temperature
-40°C~85°C / -20°C~75°C
Storage Temperature
-55°C~95°C
Operating Humidity
10%~95%
(30°C Max. Wet Bulb Temp)
Vibration
20G p-p, 80~2000Hz
Drop
75cm
Shock
1,500G@0.5ms
Power Consumption
Power Requirement
DC 3.3V
Power Operation (max.)
5000 mA
Power Idle / Standby
850 mA
Key Features
Advanced Power Shield
●
End-to-End Data Protection
●
TCG Opal 2.0
●
AES-256
●
Thermal Throttling
●
DEVSLP
●
S.M.A.R.T
●
Write Protect
◎
Quick Erase
◎
Warranty
Warranty
3 years within TBW

ORDER INFORMATION

Capacity Temp P/N
960GB -20℃ ~ 75℃ SP960GIMEC3H5SV0
1.9TB -20℃ ~ 75℃ SP019TIMEC3H5SV0
3.8TB -20℃ ~ 75℃ SP038TIMEC3H5SV0
1.9TB -40℃ ~ 85℃ SP019TIMEC3H1SW0

HERUNTERLADEN

SP ToolBox

Software
Sprache
EN
Dateiformat
exe
Version
V4.0.9
Datum
2025

MEC3H0S

Factsheet
Sprache
EN
Dateiformat
PDF
Version
v8.0
Datum
2024
VERGLEICHEN
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