3D TLC

EMC3R0

- JEDEC eMMC 5.1 compliant
- BGA153 package with 12-wire bus interface
- Supports S.M.A.R.T function
- Supports RPMB

SPEZIFIKATIONEN

Overview
Interface
eMMC 5.1
Bus Width
1-bit, 4-bit, 8-bit
Flash Technology
3D TLC
ECC Performance
LDPC
Capacity
32GB~128GB
Package
BGA153
Dimensions
11.5 x 13.0 x 1.0 mm
Performance
Seq. Performance Read(max.)
260 MB/s
Seq. Performance Write(max.)
210 MB/s
P/E Cycle
3,000
TBW
128GB: 160TB
64GB: 80TB
32GB: 40TB
Operating Environment
Operating Temperature (Ta)
-25°C~85°C
Storage Temperature
-40°C~85°C
Power Consumption(ICC / ICCQ)
Power Consumption (max.)
65 / 85 mA
Power Consumption(Standby)
20 / 150 µA
Key Features
S.M.A.R.T.
●
RPMB
●
PSA
●
Command Queue
●
Wear Leveling
●
Bad Block Management
●
Garbage Collection
●
Warranty
Warranty
1 years within TBW

ORDER INFORMATION

Capacity Temp P/N
32GB -25°C ~ 85°C SP032GIEMC3R5NE0
64GB -25°C ~ 85°C SP064GIEMC3R5NE0
128GB -25°C ~ 85°C SP128GIEMC3R5NE0

HERUNTERLADEN

EMC3R0N

Factsheet
Sprache
EN
Dateiformat
PDF
Version
v1.0
Datum
2026

SP Smart Tools

Software
Sprache
EN
Dateiformat
exe
Version
v1.0
Datum
2026
VERGLEICHEN
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