Sidefill

Introduction

Sidefill is a pivotal solution for enhancing the reliability of electronic components, specifically designed to reinforce the edges of BGA and LGA devices. This process involves the precise application of high-viscosity specialized adhesive to the corners or peripheral edges of a component, creating a robust support wall upon curing. This layer bonds securely with the PCB substrate, providing critical mechanical reinforcement for solder joints to withstand physical impacts, intense vibrations, or accidental drops by effectively distributing stress and preventing joint fractures.

Due to the material's excellent thixotropic properties, the adhesive remains localized and does not penetrate beneath the component. This technology is widely adopted in consumer electronics and automotive systems, offering the following key benefits like enhanced mechanical strength, lower thermal stress damage and simpler process control.