Temperature Definitions and Terms of DRAM memory module
Introduction
This application note introduces a general method and the criteria for measuring and ensuring that memory modules operate below their maximum allowable temperature. The specified temperatures will help ensure the reliability and functionality of Silicon Power memory modules as defined in the product data sheets.
Operating Temperature TOPER of memory modules is the case temperature (Tc) on the center / top side of the DRAM component, as defined by JEDEC JESD51-2 standards.\
The primary consideration for the functionality and reliability of semiconductor products isthe junction temperature (Tj) each DRAM component vendor. The Maximum Junction Temperature is essential that each device operates below
the defined junction temperature to ensure proper functionality and long-term reliability of the device.
Temperature Definitions and Terms
- Junction Temperature (TJ)
The Junction Temperature (TJ) is probably the most difficult to measure, but is the most important to understand or be able to estimate to ensure functionality and reliability of the product. DRAM memory component vendors provide the warranty of the Maximum Junction Temperature for each device.
- Case Temperature (TC)
The case temperature should be measured by attaching a thermocouple to the top center of the DRAM component. This should be done with a 1mm bead of conductive epoxy, as defined by the JEDEC JESD51-2 standards. The case temperature can then be used to estimate the junction temperature.
- Operating Temperature (TOPER)
Operating Temperature TOPER of memory modules is the case temperature (Tc) on the center / top side of the DRAM, as defined by JEDEC JESD51-2 standards.
