SPECIFICATIONS
Overview
Interface
PCIe Gen3x4, NVMe 1.4
Flash Technology
3D TLC
Capacity
128GB～512GB
Form Factor
M.2 2230 (M key)
Dimensions
30.0 x 22.0 x 3.5 mm
External DRAM Buffer
No
Performance
Seq. Performance Read (max.)
1180 MB/s
Seq. Performance Write (max.)
800 MB/s
Random 4K Read (IOPS max.)
73,000
Random 4K Write (IOPS max.)
150,000
MTBF @ 25°C
>3,000,000 hrs
P/E Cycle
3,000
TBW
512GB: 1,233 TB
256GB: 615 TB
128GB: 307 TB
256GB: 615 TB
128GB: 307 TB
Operating Environment
Operating Temperature
-20°C～75°C
Storage Temperature
-55°C～95°C
Operating Humidity
10%～95%
(30°C Max. Wet Bulb Temp)
(30°C Max. Wet Bulb Temp)
Vibration
20G, 10～2000Hz
Drop
75cm
Shock
1,500G@0.5ms
Power Consumption
Power Requirement
DC 3.3V
Power Operation (max.)
1800 mA
Power Idle / Standby
170 mA
Key Features
Advanced Power Shield
●
End-to-End Data Protection
●
AES-256
●
Thermal Throttling
●
DEVSLP
●
S.M.A.R.T
●
DAP
●
FWxpress
●
Warranty
Warranty
3 years within TBW
ORDER INFORMATION
| Capacity | Temp | P/N |
|---|---|---|
| 128GB | -20℃ ~ 75℃ | SP128GIMEM3K5EV0 |
| 256GB | -20℃ ~ 75℃ | SP256GIMEM3K5EV0 |
| 512GB | -20℃ ~ 75℃ | SP512GIMEM3K5EV0 |
