SPECIFICATIONS
Overview
Interface
PCIe Gen3x4, NVMe
Flash Technology
3D TLC
Capacity
256GB～2TB
Form Factor
M.2 2280 (M key)
Dimensions
80.0 x 22.0 x 3.5 mm
External DRAM Buffer
Yes
Performance
Seq. Performance Read (max.)
3,300 MB/s
Seq. Performance Write (max.)
3,000 MB/s
Random 4K Read (IOPS max.)
700,000
Random 4K Write (IOPS max.)
630,000
MTBF @ 25°C
>1,800,000 hrs
P/E Cycle
3,000
TBW
2TB: 3,040 TB
1TB: 1,420 TB
512GB: 650 TB
256GB: 270 TB
1TB: 1,420 TB
512GB: 650 TB
256GB: 270 TB
Operating Environment
Operating Temperature
0°C～70°C
Storage Temperature
-40°C～85°C
Operating Humidity
0%～90%
(40°C Max. Wet Bulb Temp)
(40°C Max. Wet Bulb Temp)
Vibration
20G p-p, 80～2000Hz
Drop
80cm
Shock
1,500G@0.5ms
Power Consumption
Power Requirement
DC 3.3V
Power Operation (max.)
1670 mA
Power Idle / Standby
1790 mA
Key Features
Advanced Power Shield
●
End-to-End Data Protection
●
TCG Opal 2.0
●
AES-256
●
Thermal Throttling
●
DEVSLP
●
S.M.A.R.T
●
Warranty
ORDER INFORMATION
| Capacity | Temp | P/N |
|---|---|---|
| 256GB | 0 ~ 70°C | SP256GIMEC3F1FV0 |
| 512GB | 0 ~ 70°C | SP512GIMEC3F1FV0 |
| 1TB | 0 ~ 70°C | SP010TIMEC3F1FV0 |
| 2TB | 0 ~ 70°C | SP020TIMEC3F1FV0 |
