3D TLC / M Key

MEA3M0E

  • NGFF M.2 standard form factor
  • Supports data security with AES-256 Encryption (optional)
  • Supports SP Toolbox S.M.A.R.T. health monitoring software

 

SPECIFICATIONS

Overview
Interface
PCIe Gen4x4, NVMe 2.0
Flash Technology
3D TLC
Capacity
128GB~2TB
Form Factor
M.2 2242 (M key)
Dimensions
42.0 x 22.0 x 3.5 mm
External DRAM Buffer
No
Performance
Seq. Performance Read (max.)
4,700 MB/s
Seq. Performance Write (max.)
4,400 MB/s
Random 4K Read (IOPS max.)
858,000
Random 4K Write (IOPS max.)
622,000
MTBF @ 25°C
>3,000,000 hrs
P/E Cycle
3,000
TBW
2TB: 3,268 TB
1TB: 1,634 TB
512GB: 577 TB
256GB: 289 TB
128GB: 144 TB
Operating Environment
Operating Temperature
-40°C~85°C / -20°C~75°C
Storage Temperature
-55°C~95°C
Operating Humidity
10%~95%
(30°C Max. Wet Bulb Temp)
Vibration
20G p-p, 10~2000Hz
Drop
75cm
Shock
1,500G@0.5ms
Power Consumption
Power Requirement
DC 3.3V
Power Operation (max.)
1670mA
Power Idle / Standby
220mA
Key Features
Advanced Power Shield
End-to-End Data Protection
TCG Opal 2.0
AES-256
Thermal Throttling
DEVSLP
S.M.A.R.T
Write Protect
Quick Erase
DAP
FWxpress
Warranty
Warranty
3 years within TBW

ORDER INFORMATION

Capacity Temp P/N
128GB -20℃ ~ 75℃ SP128GIMEA3M5EV0
256GB -20℃ ~ 75℃ SP256GIMEA3M5EV0
512GB -20℃ ~ 75℃ SP512GIMEA3M5EV0
1TB -20℃ ~ 75℃ SP010TIMEA3M5EV0
2TB -20℃ ~ 75℃ SP020TIMEA3M5EV0
256GB -40℃ ~ 105℃ SP256GIMEA3M5EW0
512GB -40℃ ~ 105℃ SP512GIMEA3M5EW0
1TB -40℃ ~ 105℃ SP010TIMEA3M5EW0
COMPARE
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