SPECIFICATIONS
Overview
Interface
SATA III/6.0Gbps
Flash Technology
pSLC(3D TLC)
Capacity
32GB～256GB
Form Factor
M.2 2260 (B+M key)
Dimensions
60.0 x 22.0 x 3.5 mm
External DRAM Buffer
Yes
Performance
Seq. Performance Read (max.)
520 MB/s
Seq. Performance Write (max.)
400 MB/s
Random 4K Read (IOPS max.)
29,000
Random 4K Write (IOPS max.)
26,000
MTBF @ 25°C
>3,000,000 hrs
P/E Cycle
30,000/3,000
TBW
256GB: 7,499 TB
128GB: 3,750 TB
64GB: 1,875 TB
32GB: 937TB
128GB: 3,750 TB
64GB: 1,875 TB
32GB: 937TB
Operating Environment
Operating Temperature
-20°C～75°C
Storage Temperature
-55°C～95°C
Operating Humidity
10%～95%
(30°C Max. Wet Bulb Temp)
(30°C Max. Wet Bulb Temp)
Vibration
20G, 10～2000Hz
Drop
75cm
Shock
1,500G@0.5ms
Power Consumption
Power Requirement
DC 3.3V
Power Operation (max.)
520 mA
Power Idle / Standby
160 mA
Key Features
Advanced Power Shield
●
TCG Opal 2.0
◎
AES-256
◎
Thermal Throttling
●
DEVSLP
●
S.M.A.R.T
●
Warranty
Warranty
5 years within TBW
ORDER INFORMATION
| Capacity | Temp | P/N |
|---|---|---|
| 32GB | -20～75°C | SP032GIMDB555SV0 |
| 32GB | -40 ~ 85℃ | SP032GIMDB555SW0 |
| 64GB | -20～75°C | SP064GIMDB555SV0 |
| 64GB | -40 ~ 85℃ | SP064GIMDB555SW0 |
| 128GB | -40 ~ 85℃ | SP128GIMDB555SE0 |
| 128GB | -20～75°C | SP128GIMDB555SV0 |
| 256GB | -20～75°C | SP256GIMDB555SV0 |
| 256GB | -40 ~ 85℃ | SP256GIMDB555SW0 |
